On October 24, 2025, the 14th China Innovation and Entrepreneurship Competition National High-End Equipment Manufacturing Competition, which has attracted much attention from the national science and technology field, came to a successful conclusion.  Osens represented Guangdong Province in the competition with its "Sub-micron High-Speed Low-Dose Online Industrial CT" project. It stood out among nearly 30,000 participating enterprises across the country and won the "Outstanding Enterprise" award in the Growth Group. This national-level award is not only an authoritative recognition of Osens' technological innovation capabilities, but also an important affirmation of its potential to drive industrial transformation in the high-end equipment field.

As the highest-level and most influential innovation and entrepreneurship event in China, the China Innovation and Entrepreneurship Competition has always aimed at "stimulating innovation potential and fostering entrepreneurial momentum", focusing on the cutting-edge of science and technology and industrial pain points, and screening out a batch of high-quality enterprises with core technologies and market competitiveness. Osens has always regarded "innovation" as the core engine of its development. It has formed a research and development team composed of senior industry experts and highly educated technical talents, focusing on key areas such as intelligent detection and industrial automation to carry out technological breakthroughs. It has successively broken through many technical bottlenecks in the industry, filled the gaps in the field, and showcased its leading technological achievements to the whole country.

As the core technological achievement of Osens in this competition, the "Sub-micron High-Speed low-dose Online Industrial CT" has broken through the limitations of the traditional detection mode - it has completely overturned the "sampling detection" link that has long been relied on in the high-end manufacturing field, achieving a technological breakthrough of "real-time comprehensive detection" This device upgrades CT equipment from an "auxiliary detection tool" to an "infrastructure-level" device for intelligent manufacturing, enhancing product yield and reliability from the source and providing key technical support for the high-quality development of the high-end manufacturing industry.

In the field of integrated circuits, for the key track of advanced packaging, it precisely addresses multiple yield pain points in advanced manufacturing processes - whether it is the minor defects in the wafer-level front-end process, wafer warpage, TSV (through-silicon via), TGV (through-glass via) filling, or the bonding accuracy of hybrid bonding interfaces and the control of chip mounting offset And the consistency detection of micro-convex point preparation can both achieve high-speed and comprehensive quality control, providing reliable detection guarantees for the integrated circuit industry to break through the bottleneck of advanced manufacturing processes.