Integrate industry, academia and research to jointly cultivate scientific and technological achievements

Under the guidance of the innovation-driven development strategy, cooperation among industry, academia and research has become a key engine for promoting scientific and technological innovation and industrial upgrading. Recently,  Osens has joined hands with Professor Yuan Zhen's team from the University of Macau. Taking the ultra-low dose active micron CT imaging technology driven by generative artificial intelligence as a breakthrough point, it is expected to overcome the key technological "bottleneck" problems. This cooperation not only converts top-notch scientific research achievements into industrial productivity, In the future, it will inject core driving force into the breakthroughs of high-precision detection technology and the intelligent transformation of industries.

Professor Yuan Zhen's team from the University of Macau

Professor Yuan Zhen from the University of Macau, as a professor at the Faculty of Health Sciences, vice dean of the Institute of Collaborative Innovation, and director of the Center for Cognitive and Brain Sciences, has published over 300 SCI papers in top international journals. The research team led by him is making progress in developing various optical imaging and ultrasound technologies independently, including photoacoustic imaging (PAT). Optical coherence tomography (OCT) and near-infrared brain functional imaging (fNIRS), as well as functional ultrasound and brain functional imaging, have profound disciplinary accumulation in these fields. Its researchers possess profound academic foundations and rich practical experience in areas such as biomedical imaging, biomedical optics, computational science, pattern recognition and signal processing algorithms, and clinical research.

OSENS

Osens has always adhered to independent research and development, deeply integrating X-ray technology, artificial intelligence technology and acoustic technology, and promoting the development of the testing field towards high precision, high efficiency and low cost. The company is committed to providing customers with high-precision and high-efficiency testing solutions. It is a specialized, refined, distinctive and innovative small and medium-sized enterprise in Guangdong Province and a national high-tech enterprise. It has passed the ISO9001:2015 Quality Management System, ISO27001:2022 Information Security Management System certification and CE-EMC certification. The company focuses on fields such as consumer electronics, semiconductor packaging and testing, and agricultural inspection. With technological innovation at its core, it provides customers with higher-quality products and services, contributing to the high-quality development of the industry.

Breaking through the bottleneck: AI-driven Innovation in Micron CT Imaging Technology

Amid the rapid development of the semiconductor and circuit manufacturing industry, how to achieve efficient and precise quality inspection of high-density, stacked packaged devices has gradually become a key thread driving industrial transformation. Traditional quality inspection methods are difficult to effectively identify the minute defects in such packages, and there are problems such as low detection efficiency and insufficient accuracy. Although the existing X-ray CT technology can provide high resolution, it still has limitations in terms of detection speed and defect recognition accuracy.

To meet the online detection requirements of high-density and stacked packaged devices, Osens has carried out in-depth industry-university-research cooperation with Professor Yuan Zhen's team from the University of Macau. Together, they have developed a generative artificial intelligence-driven ultra-low dose active micron CT imaging technology. By integrating deep learning and generative AI algorithms, they can precisely analyze image details. Enhance the spatial resolution of imaging and real-time processing capabilities, especially in defect recognition in complex stacked structures. By optimizing scanning parameters through intelligent algorithms, redundant data is reduced, radiation dose is lowered, and the chip is protected from excessive irradiation. Real-time processing and feedback are achieved, effectively overcoming the limitations of traditional X-ray CT technology. With a spatial resolution of 15 microns, a light source focus of 2 microns, 100 times magnification of the internal mechanism structure of the product, and rapid scanning imaging in 4 seconds, It can be regarded as an online CT at the level of an optical microscope. A solid step has been taken in exploring the sub-micron field of industrial CT. This collaborative achievement will break through the traditional technical bottlenecks, providing a brand-new path for the quality inspection of high-density packaged devices and helping the electronic inspection industry enhance its global market competitiveness.

Technology empowerment: Multi-field applications accelerate the intelligentization process of industries

At present, acousto-optic imaging and analysis technologies play a significant role in various fields. The existing detection and imaging technologies, such as CT and MRI, have limitations in terms of resolution, detection speed, and imaging depth, and thus cannot achieve efficient, convenient and accurate imaging. Therefore, it is necessary to combine the high resolution of optical imaging and the deep detection capability of acoustic imaging to achieve more accurate and rapid imaging and analysis of the target object.

In the field of integrated circuits, as the development moves towards advanced manufacturing processes, the demand for precise detection of the internal structure and complex connections of chips is increasing day by day. This technology can be applied to internal defect detection of chips, multi-layer structure analysis, etc., to ensure the quality and performance of chips. In the medical field, especially in the diagnosis of brain structural and functional diseases such as acute craniocerebral injury, there is also an urgent need for high-resolution and non-invasive imaging techniques. This technology can perform high-resolution imaging of brain structures, assisting in the rapid diagnosis of diseases. At the same time, artificial intelligence technology is introduced to process and analyze imaging data, improving the accuracy and efficiency of detection, automatically identifying and classifying target features, and providing personalized detection solutions for users.

With the breakthrough progress of ultra-low dose active micron CT imaging technology driven by generative artificial intelligence, its application boundaries are accelerating from semiconductor precision inspection to broader industrial fields. In the future, it can also be applied in a wider market, such as battery inspection, large-scale equipment inspection, agricultural product inspection, etc., to improve the work efficiency of inspection processes in various industries. This technology will drive industrial progress, accelerate the implementation and transformation of national strategic demands, and inject core driving force into the intelligent transformation of industries.

Industry-university-research collaboration builds the future of industries

Under the guidance of the national "14th Five-Year Plan" intelligent manufacturing strategy, intelligent detection technology centered on ultra-low-dose active micron CT is building an innovation closed loop of "technology research and development - scenario verification - industrial empowerment" through the deep integration of industry, academia and research. This technology is expected to solve the "bottleneck" problem in semiconductor packaging inspection and will provide full-chain quality protection for more strategic industries in the future. Both sides will continue to uphold the concept of innovation-driven and win-win cooperation, taking technological breakthroughs as the engine and industrial demands as the orientation, to jointly write a new chapter of coordinated development of industry, academia and research and self-reliance and self-strengthening in science and technology.